Fig. 02 — Integration
Designed into the assembly.
A metallised diamond heat spreader sits directly beneath the laser diode and conducts heat away from the device footprint.
- 01Au wire bonds
- 02Laser diode
- 03Au metallisation
- 04Diamond heat spreader
Engineereddiamond
We manufacture synthetic diamond heat spreaders, optical windows and wear-resistant components to application-specific drawings and operating requirements.
Fig. 01 — Diamond heat spreader
in a representative laser-diode assembly
- Thermal conductivity
- Up to 2,000 W/m·K
- Electrical resistivity
- ≥ 10¹² Ω·cm
- Thermal expansion
- 1.0 ppm/K at 300 K
Fig. 03 — The substrate
Thermal-grade diamond.
CVD or HPHT material, selected for high thermal conductivity, electrical insulation and dimensional stability.
- Thermal conductivity
- Up to 2,000 W/m·K
- Electrical resistivity
- ≥ 10¹² Ω·cm
- Thermal expansion
- 1.0 ppm/K at 300 K
Fig. 04 — Under heat load
Heat spreads across the plate.
High in-plane conductivity distributes heat before it enters the surrounding cooling structure.
- Thermal conductivity
- Up to 2,000 W/m·K
Fig. 05 — Material comparison
Representative conductivity values.
At room temperature, high-grade synthetic diamond can provide approximately five times the thermal conductivity of copper.
Representative room-temperature values, W/m·K. Values are grade-dependent; the comparison is illustrative.
Fig. 06 — Product form 1 of 3
Heat spreaders.
Diamond plates and submounts manufactured for high heat-flux electronic and laser assemblies.
- 01Laser diodes and bars
- 02GaN RF amplifiers
- 03Power modules
Fig. 07 — Product form 2 of 3
Optical windows.
Polished diamond plates and discs manufactured for demanding optical and radiation systems.
- 01High-power CO₂ lasers
- 02IR spectroscopy
- 03Microwave and X-ray windows
Fig. 08 — Product form 3 of 3
Wear components.
Diamond parts manufactured for wear-critical, low-friction and chemically demanding interfaces.
- 01Cutting and dressing tools
- 02Wire guides and dies
- 03Nozzles and seals
Why diamond
One material, four extremes.
Few engineering materials combine this level of thermal conductivity, electrical insulation, optical range and hardness. That is why diamond is used where conventional materials have run out of headroom.
01Thermal
5×
The thermal conductivity of copper
Representative values, W/m·K
02Electrical
10¹²+Ω·cm
An electrical insulator that conducts heat
↑ Thermal conductivity
Insulates electrically,
conducts heatCopperSiliconAlNDiamond
conducts heatCopperSiliconAlNDiamond
ConductorResistivity →Insulator
Typical values. Resistivity on a log scale
03Optical
225 nm
Deep-UV cut-off, then on through the infrared into RF
UVInfraredmm-wave · RF
225 nm10.6 µm1 mm
Illustrative transmission. Wavelength on a log scale
04Mechanical
70–100GPa
The hardest material known
Typical Vickers hardness, GPa
Products
Three component families.
Each is manufactured to drawing, with the material, grade, geometry, thickness, surface finish and metallisation chosen for the application.
- 01 / 03
Heat spreaders
Plates and submounts for high heat-flux laser, RF and power devices.
- Thermal conductivity
- 1,000–2,200 W/m·K
- Electrical resistivity
- ≥ 10¹² Ω·cm
- 02 / 03
Optical windows
Polished windows for optical and RF systems spanning ultraviolet to microwave frequencies.
- Application range
- UV → RF
- Absorption at 10.6 µm
- < 0.07 cm⁻¹
- 03 / 03
Wear components
Dies, dressers, edges and seals that hold their dimension.
- Hardness
- 70–100 GPa
- Friction coefficient
- 0.05–0.1
Applications
Where heat, light and wear set the limit.
- 01Lasers and photonicsHeatSubmounts that hold diode lasers at a stable junction temperature.≈ 0.3 nm/K
- 02RF and defence electronicsHeatHeat spreaders for GaN amplifiers in radar and communications.> 5 W/mm
- 03Power electronicsHeatElectrically insulating, thermally conductive layers for SiC and GaN power stages.≥ 10¹² Ω·cm
- 04AI and data centresHeatHeat paths for accelerators and optical interconnects.> 1 kW
- 05Optics and scienceLightWindows for lasers, gyrotrons, X-ray beams and detectors.UV → RF
- 06Industrial wearWearDies, dressers and seals that hold their dimension.70–100 GPa
Materials
CVD and HPHT, chosen per part.
We work with both growth routes and recommend the one your application needs — by area, uniformity, edge quality and cost — rather than tying every part to a single process.
CVD
CVD polycrystalline
The choice when a part needs area: large heat spreaders, optical windows and wear surfaces that can be laser-cut to almost any outline.
- Thermal conductivity
- 1,000–2,000 W/m·K
- Wafer size
- Up to Ø 100 mm
- Thickness
- 0.1–2.0 mm
- Heat spreaders above a few millimetres
- Optical and microwave windows
- Large wear surfaces
HPHT
HPHT single crystal
The choice for small parts that need the highest, most uniform conductivity or a well-defined crystallographic edge.
- Thermal conductivity
- Up to 2,200 W/m·K
- Plate size
- Up to 8 × 8 mm
- Grain boundaries
- None
- Submounts under single emitters
- Precision cutting edges
- Small precision wear parts
Production
Grown and finished under one roof.
HPHT presses and CVD reactors grow the material; laser cutting, polishing and inspection turn it into finished parts.
Send us your
requirements.
Send your drawing or application requirements. We’ll review manufacturability, recommend the appropriate diamond grade and contact you to discuss specifications, lead time and pricing.
Request a diamond component
A finished drawing is not required.