DiamTechnic

From drawing to finished part

Material selection, cutting, finishing, metallisation and inspection, handled under one specification and one point of contact.

01 Grown02 Cut03 Finished04 Metallised
Thickness
0.1–2.0 mm, ±0.05
Polished surface
Ra < 20 nm
Flatness
< 10 µm over 25 mm
Largest part
Ø 100 mm

Process

Five steps, one specification.

  1. 01

    Review

    We read your drawing or requirements — heat load, optical band, wear conditions — and confirm what can be made.

  2. 02

    Material

    We recommend CVD or HPHT and the grade that meets the requirement at the lowest cost.

  3. 03

    Cutting

    Plates and crystals are laser-cut to the outline on the drawing.

  4. 04

    Finishing

    We lap, polish and metallise parts to the specified thickness, surface finish and metal stack.

  5. 05

    Inspection

    Each batch is checked for dimensions, flatness and surface before it ships.

Production

Grown and finished under one roof.

HPHT presses and CVD reactors grow the material; laser cutting, polishing and inspection turn it into finished parts.

  1. Powder being poured into a mixing vessel

    01HPHT

    Powder preparation

    Powder mixtures for the growth cell are prepared to the recipe for each target crystal.

  2. An operator loading a hydraulic press for cell parts

    02HPHT

    Cell pressing

    Growth-cell parts are pressed and machined on our own equipment.

  3. An operator at the control panel of a cubic HPHT press

    03HPHT

    HPHT synthesis

    Single crystals grow in latest-generation cubic presses, then are cleaned out of the cell.

  4. Grown diamond crystals packed in a labelled batch bag

    04HPHT

    Sorting

    Grown crystals are sorted, labelled and tracked by batch.

  5. An engineer preparing a CVD reactor chamber

    05CVD

    Reactor preparation

    Substrates and the reactor chamber are prepared for each growth run.

  6. A microwave plasma CVD reactor on its frame

    06CVD

    CVD growth

    Microwave plasma reactors grow polycrystalline and single-crystal diamond.

  7. A laser beam cutting a diamond plate

    07Finishing

    Laser cutting

    Precision laser systems cut plates and crystals to the outline on the drawing.

  8. An engineer at a diamond polishing machine

    08Finishing

    Polishing

    Plates are lapped and polished on manual and automatic machines.

  9. A diamond plate inspected under a polarising microscope

    09Finishing

    Inspection

    Crystals, plates and substrates are checked under a polarising microscope.

Processing

Tolerances and finishes.

Typical values for standard work. Tighter tolerances are quoted per project.

Thickness
0.1–2.0 mm±0.05 mm
Outline
Laser-cut to drawing+0.1 / −0 mm
Surface
As-grown, lapped, polishedRa < 20 nm polished
Flatness
< 10 µmOver 25 mm
Parallelism
< 5 arcminOptical parts
Metallisation
Ti/Pt/Au, Ti/Au, Cr/AuAuSn pre-solder

Metallisation

Ready to solder.

Heat spreaders and submounts can be supplied metallised and pre-soldered, so they go straight into die attach.

StackTypical layersUsed for
Ti / Pt / Au0.05–0.1 / 0.1–0.2 / 0.5–3 µmStandard for AuSn die attach; Pt blocks solder diffusion
Ti / Au0.05–0.1 / 0.5–3 µmWire bonding and general soldering
Cr / Au0.05–0.1 / 0.5–3 µmAlternative adhesion layer
AuSn 80/202–8 µmPre-deposited solder for fluxless die attach

Quality

Checked before it ships.

Every batch is inspected against the drawing. Prototype quantities for qualification and recurring production volumes follow the same process.

  1. 01Dimensions and thickness
  2. 02Flatness and parallelism
  3. 03Surface roughness
  4. 04Visual inspection for chips and cracks
  5. 05Metallisation adhesion
  6. 06Thermal conductivity data on request

Have a drawing or a heat problem?

Send your drawing or operating requirements. We’ll review manufacturability, recommend the diamond grade and reply with specifications, lead time and pricing.

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