Heat spreaders
Diamond plates and submounts that remove heat from laser, RF and power devices with higher bulk thermal conductivity than conventional thermal-management materials, while remaining electrically insulating and dimensionally stable.
- Thermal conductivity
- 1,000–2,200 W/m·K
- Electrical resistivity
- ≥ 10¹² Ω·cm
- Thermal expansion
- 1.0 ppm/K
- Thickness
- 0.1–2.0 mm
Formats
What we make.
- 01
Submounts
Laser-cut, metallised and pre-soldered parts sized to a single die, emitter or bar.
- 02
Plates
Lapped or polished plates placed between the device and the cold plate or package base.
- 03
Wafers and discs
CVD wafers up to Ø 100 mm for large-area spreading or for dicing in your own line.
Production
Made on our own floor.
Specifications
Typical values.
Standard ranges. Tighter tolerances and other configurations are quoted per project; the final specification is confirmed in the quotation.
- Material
- CVD polycrystalline, HPHT single crystal
- Thermal grade
- 1,000–2,000 W/m·K CVDUp to 2,200 W/m·K HPHT
- Lateral size
- 1 × 1 mm to Ø 100 mm
- Thickness
- 0.1–2.0 mm±0.05 mm
- Outline
- Laser-cut to drawing+0.1 / −0 mm
- Surface
- Lapped or polishedRa < 20 nm polished
- Flatness
- < 10 µmOver 25 mm
- Metallisation
- Ti/Pt/Au, Ti/Au, Cr/Au
- Solder
- AuSn 80/20 pre-deposited
Grades
Recommended grades.
| Grade | Material | Key value | Typical use |
|---|---|---|---|
| Thermal 1000 | CVD | ≥ 1,000 W/m·K | Power modules, cost-sensitive spreaders |
| Thermal 1500 | CVD | ≥ 1,500 W/m·K | GaN RF amplifiers, laser bars |
| Thermal 1800 | CVD | ≥ 1,800 W/m·K | High heat-flux laser diodes |
| Thermal 2000 | CVD | ≥ 2,000 W/m·K | Highest heat-flux devices |
| Single crystal | HPHT | Up to 2,200 W/m·K | Single-emitter submounts, precision parts |
Applications
Where heat spreaders are used.
- ≈ 0.3 nm/KWavelength drift of a GaAs laser diode with temperature
Lasers and photonics
Submounts that hold diode lasers at a stable junction temperature.
- > 5 W/mmTypical output power density of a GaN HEMT
RF and defence electronics
Heat spreaders for GaN amplifiers in radar and communications.
- ≥ 10¹² Ω·cmElectrical resistivity of thermal-grade diamond
Power electronics
Electrically insulating, thermally conductive layers for SiC and GaN power stages.
- > 1 kWPower draw of a leading liquid-cooled AI accelerator
AI and data centres
Heat paths for accelerators and optical interconnects.
Have a drawing or a heat problem?
Send your drawing or operating requirements. We’ll review manufacturability, recommend the diamond grade and reply with specifications, lead time and pricing.